Low Temperature Heat-sealable adhesion polyimide film
저온 열경화성 Tape으로 방수/방진을 주 목적으로 합니다.
Ex) 휴대폰 Home key, Volume key 등..
Items | Value | |
---|---|---|
Softening point | 60ºC | |
Activation point | 100ºC | |
Lamination Temp. (recommended) |
Bonding | 120 ~ 150ºC |
Cooling | 20 ~ 25ºC | |
Temperature resistance |
Short term | 260ºC |
Long term | 230ºC | |
Silicone peel strength | 600gf/in | |
* Shear strength | 3000N/312mm² |
* Shear strength test condition : on polycarbonate according to DIN EN 1465, at 23±2ºC